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magnetic resin shielded power inductors LanTu Micro SNR4030-100MT with low buzz noise and high saturation current

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magnetic resin shielded power inductors LanTu Micro SNR4030-100MT with low buzz noise and high saturation current

Current - Saturation (Isat) : 1.95A

Description : 1.95A SMD,4x4mm Fixed Inductors RoHS

Mfr. Part # : SNR4030-100MT

Model Number : SNR4030-100MT

Package : SMD,4x4mm

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Product Overview

The SNR4030 Series Magnetic Resin Shielded SMD Power Inductors from SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD. are automatic assembly constructed power inductors featuring magnetic resin shielding. This design significantly reduces buzz noise to ultra-low levels, offers large current handling with low DC resistance, and provides excellent shock resistance and damage-free durability due to metallization on the ferrite core. The closed magnetic circuit design minimizes leakage flux and electromagnetic interference (EMI), while the compact size saves PCB real estate and power. These inductors are widely used in applications such as LED backlights, flat-screen TVs, notebooks, servers, graphic cards, automotive products, and DC-DC converters.

Product Attributes

  • Brand: LANTU MICRO ELECTRIC
  • Series: SNR4030
  • Construction: Automatic assembly, Magnetic resin shielded
  • Certifications: RoHS, Halogen Free, REACH Compliance
  • Origin: SHENZHEN, China

Technical Specifications

Part No. Inductance (H) Inductance Tolerance Test Frequency (100KHz, 1.0V) DCR () Typical DCR () Max Saturation Current (A) Max Temperature Rise Current (A) Max Dimensions (LWH mm)
SNR4030-1R0M 1.0 20% 100KHz, 1.0V 0.014 0.018 5.26 4.15 4.04.03.0
SNR4030-1R2M 1.2 20% 100KHz, 1.0V 0.015 0.020 5.26 3.82 4.04.03.0
SNR4030-1R5M 1.5 20% 100KHz, 1.0V 0.020 0.026 4.84 3.34 4.04.03.0
SNR4030-1R8M 1.8 20% 100KHz, 1.0V 0.025 0.033 4.84 3.20 4.04.03.0
SNR4030-2R2M 2.2 20% 100KHz, 1.0V 0.030 0.039 4.40 2.95 4.04.03.0
SNR4030-3R3M 3.3 20% 100KHz, 1.0V 0.040 0.050 3.30 2.40 4.04.03.0
SNR4030-4R7M 4.7 20% 100KHz, 1.0V 0.060 0.076 2.90 2.00 4.04.03.0
SNR4030-5R6M 5.6 20% 100KHz, 1.0V 0.073 0.091 2.75 1.90 4.04.03.0
SNR4030-6R8M 6.8 20% 100KHz, 1.0V 0.090 0.115 2.60 1.60 4.04.03.0
SNR4030-8R2M 8.2 20% 100KHz, 1.0V 0.095 0.122 2.10 1.60 4.04.03.0
SNR4030-100M 10 20% 100KHz, 1.0V 0.100 0.130 1.95 1.50 4.04.03.0
SNR4030-120M 12 20% 100KHz, 1.0V 0.135 0.172 1.70 1.30 4.04.03.0
SNR4030-150M 15 20% 100KHz, 1.0V 0.190 0.230 1.65 1.11 4.04.03.0
SNR4030-220M 22 20% 100KHz, 1.0V 0.225 0.290 1.30 1.00 4.04.03.0
SNR4030-330M 33 20% 100KHz, 1.0V 0.330 0.420 1.10 0.84 4.04.03.0
SNR4030-470M 47 20% 100KHz, 1.0V 0.445 0.570 0.95 0.72 4.04.03.0
SNR4030-680M 68 20% 100KHz, 1.0V 0.868 1.100 0.72 0.52 4.04.03.0
SNR4030-820M 82 20% 100KHz, 1.0V 1.060 1.280 0.66 0.47 4.04.03.0
SNR4030-101M 100 20% 100KHz, 1.0V 1.150 1.480 0.60 0.45 4.04.03.0
SNR4030-121M 120 20% 100KHz, 1.0V 1.350 1.700 0.55 0.42 4.04.03.0
Inductance Tolerance Codes: J:5%, K: 10%, L: 15%, M: 20%, P: 25%, N: 30%
Operating Temperature: -40 to +125 (Including coils self-temperature rise)
Saturation Current: DC current at which inductance drops 30% from its value without current.
Temperature Rise Current: The actual value of DC current when the temperature rise is T 40 (Ta=25).
Rated DC Current: The lesser value of Isat or Irms.
Shape and Dimensions (mm): L=4.00.3, W=4.00.3, H=3.0 Max
Recommended Land Pattern (mm): A=2.10.2, B=3.30.2, C=1.1 Typ, D=1.9 Typ, E=3.7 Typ
Packaging: Bulk Package (B), Tape & Reel (T)

Reliability Testing

Item Requirements Test Methods and Remarks
Terminal Strength (SMT) Meet requirements without any loose terminal. Pulling test based on terminal area; Solder paste thickness: 0.12mm; Keep time: 101s; Speed: 1.0mm/s.
Terminal Strength (DIP) Meet requirements without any loose terminal. Applied force based on terminal diameter (0.35mm to >1.25mm); Duration: 10sec.
Resistance to Flexure No visible mechanical damage. Flexure: 2mm; Pressurizing Speed: 0.5mm/sec; Keep time: 30 sec.
Dropping No case deformation or change in appearance; No short and no open. Drop packaged products from 1m high in 1 angle, 3 ridges and 6 surfaces, twice in each direction.
Solderability No visible mechanical damage; Wetting shall exceed 75% coverage; Terminals must have 95% minimum solder coverage. Solder temperature: 2402; Duration: 3 sec; Solder: Sn/3.0Ag/0.5Cu; Flux: 25% Resin and 75% ethanol.
Vibration No visible mechanical damage; Inductance change: Within 10%; Q factor change: Within 20%. Frequency: 10 to 55 Hz and return to 10 Hz in 1 minute; Applied for 2 hours in each of 3 mutually perpendicular directions.
Thermal Shock No visible mechanical damage; Inductance change: Within 10% (Mn-Zn: Within 30%); Q factor change: Within 20%. Cycles: 100; Transforming interval: Max. 20 sec.
Low temperature Storage No visible mechanical damage; Inductance change: Within 10% (Mn-Zn: Within 30%); Q factor change: Within 20%. Temperature: -55~-402; Duration: 962 hours.
High temperature Storage No visible mechanical damage; Inductance change: Within 10% (Mn-Zn: Within 30%); Q factor change: Within 20%. Temperature: 85~1252; Duration: 962 hours.
Damp Heat (Steady States) No visible mechanical damage; Inductance change: Within 10% (Mn-Zn: Within 30%); Q factor change: Within 20%. Temperature: 602; Humidity: 90% to 95% RH; Duration: 962 hours.
Heat endurance of Reflow soldering No significant defects in appearance; L/L10% (Mn-Zn: L/L30%); Q/Q30% (SMD series only); DCR/DCR10%. Refer to reflow curve, go through reflow twice; Peak temperature: 260+0/-5.
Resistance to solvent test No case deformation or change in appearance or obliteration of marking. Dip parts into IPA solvent for 50.5Min, dry for 5Min, brush 10 times.
Overload test During test no smoke, no peculiar smell, no fire; Characteristics normal after test. Apply twice rated current for 5 minutes.
Voltage resistance test During test no breakdown; Characteristics normal after test. DC1000V, Current: 1mA, Time: 1Min. (For parts with two coils)

Recommended Reflow Soldering Curve

The recommended reflow conditions are set according to LANTU's soldering equipment. Users should adjust and confirm based on their specific environment and equipment.

Reminders for Using These Products

  • Storage: Within 12 months, at temperature 5~40C and humidity 35~65% RH. Solderability may deteriorate if storage period elapses.
  • Environment: Do not use or store in gas corrosive environments (salt, acid, alkali, etc.).
  • Handling: Avoid direct contact with terminals by bare hands due to oil secretions. Handle products carefully to prevent damage. Do not bend terminals excessively.
  • Cleaning: Do not rinse coils. Contact LANTU if cleaning is necessary.
  • Magnetic Fields: Do not expose to magnets or magnetic fields.
  • Preheating: Preheat components before soldering. Temperature difference between solder and chip should not exceed 150C.
  • Soldering Corrections: Corrections after mounting should be within specified conditions. Overheating may cause short circuits, performance degradation, or reduced lifespan.
  • Thermal Design: Allow sufficient margin for self-heating when power is ON.
  • Non-magnetic Shield Type: Careful layout is needed to avoid malfunctions due to magnetic interference.

2410121647_LanTu-Micro-SNR4030-100MT_C5127395.pdf


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